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BYT260PIV-400 BYT261PIV-400
FAST RECOVERY RECTIFIER DIODES
FEATURES VERY LOW REVERSE RECOVERY TIME VERY LOW SWITCHING LOSSES LOW NOISE TURN-OFF SWITCHING INSULATED PACKAGE : Insulating voltage = 2500 VRMS Capacitance = 45 pF
K2 A2 A2 K1
K1
A1
K2
A1
BYT261PIV-400
BYT260PIV-400
DESCRIPTION Dual high voltage rectifiers ranging from 400V to 200V suited for Switch Mode Power Supplies and other power converters. The devices are packaged in ISOTOP. ABSOLUTE MAXIMUM RATINGS Symbol IFRM IF(RMS) IF(AV) IFSM Tstg Tj Parameter Repetitive peak forward current RMS forward current Average forward current Surge non repetitive forward current Storage and junction temperature range
Tc=80C = 0.5 tp=10ms sinusoidal
ISOTOPTM (Plastic)
Value tp 10s
Per diode Per diode Per diode
Unit A A A A C C
800 140 60 600 - 40 to + 150 - 40 to + 150
Symbol VRRM
Parameter Repetitive peak reverse voltage
BYT261PIV-/BYT260PIV200 200 300 300 400 400
Unit V
TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics.
August 1996 - Ed : 2B
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BYT261PIV-400
THERMAL RESISTANCE Symbol Rth (j-c) Rth (c) Junction to case Coupling Parameter
Per diode Total
Value 0.7 0.4 0.1
Unit C/W C/W
When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode) x Rth(Per diode) + P(diode 2) x Rth(c) ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol VF
*
Test Conditions Tj = 25C Tj = 100C IF = 60 A
Min.
Typ.
Max. 1.5 1.4
Unit V
IR **
Tj = 25C Tj = 100C
VR = VRRM
60 6
A mA
Pulse test : * tp = 380 s, duty cycle < 2 % ** tp = 5 ms, duty cycle < 2 %
RECOVERY CHARACTERISTICS Symbol trr Tj = 25C Test Conditions IF = 0.5A IR = 1A IF = 1A VR = 30V Irr = 0.25A dIF/dt = -15A/s Min. Typ. Max. 50 100 Unit ns
TURN-OFF SWITCHING CHARACTERISTICS (Without serie inductance) Symbol tIRM dIF/dt = -240A/s dIF/dt = -480A/s IRM dIF/dt = -240A/s dIF/dt = -480A/s TURN-OFF OVERVOLTAGE COEFFICIENT (With serie inductance) Symbol Test Conditions Tj = 100C VCC = 120V IF=IF(AV) dIF/dt = -60A/s Lp = 0.8H see note see fig.12 Min. Typ. 3.3 Max. 4 Unit / 24 Test Conditions VCC = 200V Lp 0.05H see fig. 11 IF = 60A Tj = 100C Min. Typ. Max. 75 50 18 A Unit ns
C=
VRP VCC
Note : Applicable to BYT261PIV-400 only To evaluate the conduction losses use the following equation : P = 1.1 x IF(AV) + 0.0045 x IF2(RMS)
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BYT261PIV-400
Fig.1 : Low frequency power losses versus average current.
P F(av)(W)
Fig.2 : Peak current versus form factor.
120 110 =1 =0.1 =0.5 =0.2 =0.05 100 90 80 70 60 50 T 40 30 20 10 I F(av)(A) =tp/T tp 0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
Fig.3 : Non repetitive peak surge current versus overload duration.
Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration.
K=Zth(j-c)/Rth(j-c) 1
=0.5
=0.2
= 0. 1
T
SINGLE PULSE
t(s)
=tp/ T
tp
0.1 0.001
0.01
0.1
1
10
Fig.5 : Voltage drop versus forward current.
Fig.6 : Recovery charge versus diF/dt.
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Fig.7 : Recovery time versus dIF/dt. Fig.8 : Peak reverse current versus dIF/dt.
Fig.9 : Peak forward voltage versus dIF/dt.
Fig.10 : Dynamic parameters versus junction temperature.
Fig.11 : TURN-OFF SWITCHING CHARACTERISTICS (Without serie inductance)
Fig.12 : TURN-OFF SWITCHING CHARACTERISTICS (With serie inductance)
IF DUT LC VCC VF diF /dt LC
LP
IF DUT d iF/d t VCC VF VCC IR M VCC tIRM VRP
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BYT261PIV-400
PACKAGE MECHANICAL DATA ISOTOP
REF.
M G / OJ O B A
DIMENSIONS Millimeters Inches Min. 11.80 8.90 1.95 0.75 12.60 25.10 31.50 4.00 4.10 4.10 14.90 30.10 37.80 7.80 5.50 Max. 12.20 9.10 2.05 0.85 12.80 25.50 31.70 4.30 4.30 15.10 30.30 38.20 8.20 Min. 0.465 0.350 0.077 0.029 0.496 0.988 1.240 0.157 0.161 0.161 0.586 1.185 1.488 0.307 0.216 Max. 0.480 0.358 0.081 0.034 0.504 1.004 1.248 0.169 0.169 0.595 1.193 1.504 0.323
/ OI
/ OI D H E F
C K L P
sc re w H M4
A B C D E F G H I J K L M O P
Cooling method : C Marking : Type number Weight : 28 g (without screws) Electric isolation : 2500V(RMS) Capacitance : < 45 pF Inductance : < 5 nH - Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min and 2.2 mm max.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
(c) 1996 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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